Packaging Services
Turnkey Packaging Services
To ensure that each product meets systems performance specifications, Apex provides product package evaluation, package design, substrate layout and complete electrical and thermal simulation. Our packaging services include architectural feasibility, floor planning and optimization, chip-package-PCB co- design, SI and PI analysis, and heatsink design.
Monolithic Die
Chiplets
- Homogeneous
- Heterogeneous
2.5D
- Silicon interposer [InFO, CoWoS]
- Organic substrate
Architecture feasibility & floorplanning
Bump optimization
Chip-package-PCB co-design
- Signal and power integrity analysis
- High-speed/high-bandwidth serial and parallel interfaces
- Thermal/mechanical analysis
- Heatsink design
- BOM optimization
- Assembly drawing
- Package drawing
Thermal/mechanical Analysis
- Warpage
- Coplanarity
- Reliability
- Joule heating
- Heatsink requirements
Heatsink design
- Heat spreader
- TIM selection
BOM optimization/Assembly drawing/Package drawing
- For release to manufacturing
- Design deliverables
MCM/GDS
- Interconnect models